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 TH72036
868/915MHz FSK/ASK Transmitter Features
! ! ! ! ! ! ! ! Fully integrated PLL-stabilized VCO Frequency range from 850 MHz to 930 MHz Single-ended RF output FSK through crystal pulling allows modulation from DC to 40 kbit/s High FSK deviation possible for wideband data transmission ASK achieved by on/off keying of internal power amplifier up to 40 kbit/s Wide power supply range from 1.95 V to 5.5 V Very low standby current ! ! ! ! ! ! ! ! Microcontroller clock output On-chip low voltage detector High over-all frequency accuracy FSK deviation and center frequency independently adjustable Adjustable output power range from -11 dBm to +9.5 dBm Adjustable current consumption from 5.5 mA to 13.8 mA Conforms to EN 300 220 and similar standards 10-pin Quad Flat No-Lead Package (QFN)
Ordering Information
Part Number TH72036
Application Examples
! ! ! ! ! ! ! ! !
General digital data transmission Tire Pressure Monitoring Systems (TPMS) Remote Keyless Entry (RKE) Wireless access control Alarm and security systems Garage door openers Remote Controls Home and building automation Low-power telemetry systems
Y R A IN IM L E R P
Temperature Code Package Code K (-40 C to 125 C) LD (10L QFN 3x3 Dual)
Delivery Form
120 pc/tray 5000 pc/T&R
Pin Description
top
bottom VCC VEE OUT CKDIV PSEL
10 9 8 7 6 1 2 3 4 5
FSKDTA FSKSW ROI EN CKOUT
TH72036
General Description
The TH72036 FSK/ASK transmitter IC is designed for applications in the European 868 MHz industrialscientific-medical (ISM) band, according to the EN 300 220 telecommunications standard. It can also be used for any other system with carrier frequencies ranging from 850 MHz to 930 MHz (e.g. for applications in the US 902 to 928 MHz ISM band). The transmitter's carrier frequency fc is determined by the frequency of the reference crystal fref. The integrated PLL synthesizer ensures that carrier frequencies, ranging from 850 MHz to 930 MHz, can be achieved. This is done by using a crystal with a reference frequency according to: fref = fc/N, where N = 32 is the PLL feedback divider ratio. A clock signal with selectable frequency is provided. It can be used to drive a microcontroller.
3901072036 Rev. 005
Page 1 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter Document Content
1 Theory of Operation ...................................................................................................3
1.1 1.2 General............................................................................................................................. 3 Block Diagram .................................................................................................................. 3
2
Functional Description ..............................................................................................3
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 Crystal Oscillator .............................................................................................................. 3 FSK Modulation ................................................................................................................ 4 Crystal Pulling................................................................................................................... 4 ASK Modulation................................................................................................................ 5 Output Power Selection.................................................................................................... 5 Lock Detection.................................................................................................................. 5 Low Voltage Detection...................................................................................................... 5 Mode Control Logic .......................................................................................................... 6 Clock Output..................................................................................................................... 6 Timing Diagrams .............................................................................................................. 6
3 4
Pin Definition and Description ..................................................................................7 Electrical Characteristics ..........................................................................................8
4.1 4.2 4.3 4.4 4.5 4.6 4.7 Absolute Maximum Ratings .............................................................................................. 8 Normal Operating Conditions ........................................................................................... 8 Crystal Parameters ........................................................................................................... 8 DC Characteristics............................................................................................................ 9 AC Characteristics .......................................................................................................... 10 AC Characteristics .......................................................................................................... 11 Output Power Steps - ASK Mode .................................................................................. 11
Y R A IN IM L E R P
5
Test Circuit ...............................................................................................................12
5.1 Test circuit component list to Fig. 6 ................................................................................ 12
6
Package Description ................................................................................................13
6.1 6.2 Soldering Information ..................................................................................................... 13 Recommended PCB Footprints ...................................................................................... 13
7 8 9
Reliability Information..............................................................................................14 ESD Precautions ......................................................................................................14 Disclaimer .................................................................................................................16
3901072036 Rev. 005
Page 2 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 1 Theory of Operation
1.1 General
As depicted in Fig.1, the TH72036 transmitter consists of a fully integrated voltage-controlled oscillator (VCO), a divide-by-32 divider (div32), a phase-frequency detector (PFD) and a charge pump (CP). An internal loop filter determines the dynamic behavior of the PLL and suppresses reference spurious signals. A Colpitts crystal oscillator (XOSC) is used as the reference oscillator of a phase-locked loop (PLL) synthesizer. The VCO's output signal feeds the power amplifier (PA). The RF signal power Pout can be adjusted in four steps from Pout = -11 dBm to +9.5 dBm, either by changing the value of resistor RPS or by varying the voltage VPS at pin PSEL. The open-collector output (OUT) can be used either to directly drive a loop antenna or to be matched to a 50Ohm load. Bandgap biasing ensures stable operation of the IC at a power supply range of 1.95 V to 5.5 V.
1.2 Block Diagram
CKOUT
5
ROI
3 XTAL FSKSW CX2 CX1 2
Y R A IN IM L E R P
RPS R1
ASKDTA CKDIV VCC PSEL
7
10
6
PLL
div 8 div 32
32
PA
8
OUT
antenna matching network
PFD
XOSC
XBUF
CP
VCO
mode control
4
ENTX
1
FSKDTA
9
VEE
Fig. 1: Block diagram with external components
2 Functional Description
2.1 Crystal Oscillator
A Colpitts crystal oscillator with integrated functional capacitors is used as the reference oscillator for the PLL synthesizer. The equivalent input capacitance CRO offered by the crystal oscillator input pin ROI is about 18pF. The crystal oscillator is provided with an amplitude control loop in order to have a very stable frequency over the specified supply voltage and temperature range in combination with a short start-up time.
3901072036 Rev. 005
Page 3 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter
2.2 FSK Modulation
FSK modulation can be achieved by pulling the crystal oscillator frequency. A CMOScompatible data stream applied at the pin FSKDTA digitally modulates the XOSC via an integrated NMOS switch. Two external pulling capacitors CX1 and CX2 allow the FSK deviation f and the center frequency fc to be adjusted independently. At FSKDTA = 0, CX2 is connected in parallel to CX1 leading to the lowfrequency component of the FSK spectrum (fmin); while at FSKDTA = 1, CX2 is deactivated and the XOSC is set to its high frequency fmax. An external reference signal can be directly ACcoupled to the reference oscillator input pin ROI. Then the transmitter is used without a crystal. Now the reference signal sets the carrier frequency and may also contain the FSK (or FM) modulation. Fig. 2: Crystal pulling circuitry
ROI
VCC
XTAL
FSKSW
CX2 CX1
VEE
2.3 Crystal Pulling
A crystal is tuned by the manufacturer to the required oscillation frequency f0 at a given load capacitance CL and within the specified calibration tolerance. The only way to pull the oscillation frequency is to vary the effective load capacitance CLeff seen by the crystal. Figure 3 shows the oscillation frequency of a crystal as a function of the effective load capacitance. This capacitance changes in accordance with the logic level of FSKDTA around the specified load capacitance. The figure illustrates the relationship between the external pulling capacitors and the frequency deviation. It can also be seen that the pulling sensitivity increases with the reduction of CL. Therefore, applications with a high frequency deviation require a low load capacitance. For narrow band FSK applications, a higher load capacitance could be chosen in order to reduce the frequency drift caused by the tolerances of the chip and the external pulling capacitors.
Y R A IN IM L E R P
0 1
f XTAL L1 f max C1 R1 fc f min
CX1 CRO CX1+CRO CL (CX1+CX2) CRO CX1+CX2+CRO
FSKDTA
Description
fmin= fc - f (FSK switch is closed) fmax= fc + f (FSK switch is open)
C0
CL eff
CL eff
Fig. 3: Crystal pulling characteristic
For ASK applications CX2 can be omitted. Then CX1 has to be adjusted for center frequency.
3901072036 Rev. 005
Page 4 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter
2.4 ASK Modulation
The TH72036 can be ASK-modulated by applying data directly at pin PSEL. This turns the PA on and off which leads to an ASK signal at the output.
2.5
Output Power Selection
The transmitter is provided with an output power selection feature. There are four predefined output power steps and one off-step accessible via the power selection pin PSEL. A digital power step adjustment was chosen because of its high accuracy and stability. The number of steps and the step sizes as well as the corresponding power levels are selected to cover a wide spectrum of different applications. The implementation of the output power control logic is shown in figure 4. There are two matched current sources with an amount of about 8 A. One current source is directly applied to the PSEL pin. The other current source is used for the generation of reference voltages with a resistor ladder. These reference voltages are defining the thresholds between the power steps. The four comparators deliver thermometer-coded control signals depending on the voltage level at the pin PSEL. In order to have a certain amount of ripple tolerance in a noisy environment the comparators are provided with a little hysteresis of about 20 mV. With these control signals, weighted current sources of the power amplifier are switched on or off to set the desired output power level (Digitally Controlled Current Source). The LOCK, ASK signal and the output of the low voltage detector are gating this current source.
Y R A IN IM L E R P
RPS
PSEL
&
&
&
&
&
OUT
Fig. 4: Block diagram of output power control circuitry
There are two ways to select the desired output power step. First by applying a DC voltage at the pin PSEL, then this voltage directly selects the desired output power step. This kind of power selection can be used if the transmission power must be changed during operation. For a fixed-power application a resistor can be used which is connected from the PSEL pin to ground. The voltage drop across this resistor selects the desired output power level. For fixed-power applications at the highest power step this resistor can be omitted. The pin PSEL is in a high impedance state during the "TX standby" mode.
2.6
Lock Detection
The lock detection circuitry turns on the power amplifier only after PLL lock. This prevents from unwanted emission of the transmitter if the PLL is unlocked.
2.7
Low Voltage Detection
The supply voltage is sensed by a low voltage detect circuitry. The power amplifier is turned off if the supply voltage drops below a value of about 1.85 V. This is done in order to prevent unwanted emission of the transmitter if the supply voltage is too low.
3901072036 Rev. 005
Page 5 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter
2.8 Mode Control Logic
EN 0 1 Mode TX standby TX active CKOUT active Description TX disabled TX / CKOUT enabled
The mode control logic allows two different modes of operation as listed in the following table. The mode control pin EN is pulled-down internally. This guarantees that the whole circuit is shut down if this pin is left floating.
2.9
Clock Output
The clock output CKOUT is CMOS-compatible and can be used to drive a microcontroller. The frequency of the clock can be selected by the clock divider control signal CKDIV, according to the following table. A capacitor at pin CKOUT can be used to control the clock voltage swing and the RF spurious emission. CKDIV 0 1
2.10 Timing Diagrams
After enabling the transmitter by the EN signal, the power amplifier remains inactive for the time ton, the transmitter start-up time. The crystal oscillator starts oscillation and the PLL locks to the desired output frequency within the time duration ton. After successful PLL lock, the LOCK signal turns on the power amplifier, and then the RF carrier can be FSK or ASK modulated.
high
Y R A IN IM L E R P
8 32 3.39MHz 848kHz
high
Clock divider ratio
Clock frequency / fc=868.3MHz
EN
low
high
EN
low
high
LOCK
low
LOCK
low
high
high
FSKDTA
low
PSEL
low
RF carrier
t
t
t on
t on
Fig. 5: Timing diagrams for FSK and ASK modulation
3901072036 Rev. 005
Page 6 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 3 Pin Definition and Description
Pin No. 1 Name FSKDTA I/O Type input
FSKDTA 1
1.5k
Functional Schematic
0: ENTX=1 1: ENTX=0
Description FSK data input, CMOS compatible with internal pull-up circuit TX standby: no pull-up TX active: pull-up XOSC FSK pulling pin, MOS switch
2
FSKSW
analog I/O
FSKSW 2
3
ROI
4
EN
5
CKOUT
Y R A IN IM L E R P
analog I/O
25k
XOSC connection to XTAL, Colpitts type crystal oscillator
ROI 3
36p
36p
input
EN 4
1.5k
mode control input, CMOS-compatible with internal pull-down circuit
output
clock output, CMOS-compatible
CKOUT 5
400
6
PSEL
analog I/O
8A
PSEL 6
power select input, highimpedance comparator logic TX standby: IPSEL = 0 TX active: IPSEL = 8A clock divider control input, CMOS compatible with internal pull-down circuit
1.5k
7
CKDIV
input
CKDIV 7
0: ENTX=0 1: ENTX=1 1.5k
TX standby: no pull-down TX active: pull-down power amplifier output, open collector
8
OUT
output
OUT 8
VCC
VEE
VEE
9 10
VEE VCC
ground supply
negative power supply positive power supply
3901072036 Rev. 005
Page 7 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Parameter Supply voltage Input voltage Storage temperature Junction temperature Thermal Resistance Power dissipation Electrostatic discharge Symbol VCC VIN TSTG TJ RthJA Pdiss VESD human body model (HBM) according to CDF-AECQ100-002 2.0 Condition Min 0 -0.3 -65 Max 7.0 VCC+0.3 150 150 49 0.12 Unit V V C C K/W W kV
4.2 Normal Operating Conditions
Parameter Supply voltage Symbol VCC TA VIL fref fc fCLK f R R
Operating temperature
Input low voltage CMOS XOSC frequency VCO frequency Clock frequency FSK deviation FSK Data rate ASK Data rate
Input high voltage CMOS
Y R A IN IM L E R P
Condition Min -40 Max 5.5 125 1.95 EN, FSKDTA EN, FSKDTA 0.3*VCC 29 VIH 0.7*VCC 26.6 850 3.3 831 2.5 set by the crystal fc = 32 * fref CKDIV=0, fCLK = fref / 8 CKDIV=1, fCLK = fref / 32 depending on CX1, CX2 and crystal parameters NRZ NRZ 930 3.6 906 40 40 40
Unit V C V V MHz MHz MHz kHz kHz kbit/s kbit/s
4.3 Crystal Parameters
Parameter Crystal frequency Load capacitance Static capacitance Series resistance Spurious response Symbol f0 CL C0 R1 aspur only required for FSK Condition fundamental mode, AT Min 26.6 10 Max 29 15 7 50 -10 Unit MHz pF pF dB
3901072036 Rev. 005
Page 8 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter
4.4 DC Characteristics
all parameters under normal operating conditions, unless otherwise stated; typical values at TA = 23 C and VCC = 3 V Parameter Operating Currents Standby current Supply current in power step 0 Supply current in power step 1 Supply current in power step 2 Supply current in power step 3 Supply current in power step 4 Digital Pin Characteristics Input low voltage CMOS Pull down current, EN Input high voltage CMOS ISBY ICC0 ICC1 ICC2 ICC3 ICC4 VIL EN=0, TA=85C EN=0, TA=125C EN=1 EN=1 EN=1 EN=1 EN=1 2.5 3.5 4.5 6.2 9.4 4.3 5.5 6.8 9.0 13.8 0.2 200 4 6.5 8.1 9.6 12.2 18.1 nA A mA mA mA mA mA Symbol Condition Min Typ Max Unit
Low level input current, EN Pull up current FSKDTA active mode Pull up current FSK standby mode
High level input current, FSKDTA
Low level input current CKDIV Pull-down current CKDIV active mode Pull-down current CKDIV standby mode FSK Switch Resistance MOS switch On resistance MOS switch Off resistance
Y R A IN IM L E R P
EN, FSKDTA EN, FSKDTA EN=1 -0.3 0.2 VIH 0.7*VCC IPDEN 4.0 40 IINLEN EN=0 0.02 12 IINHDTA FSKDTA=1 0.02 IPUDTAa IPUDTAs FSKDTA=0, EN=1 0.1 1.5 FSKDTA=0, EN=0 0.02 IINLCKDIV CKDIV=0 0.02 12 0.02 IPDCKDIVa CKDIV=1, EN=1 IPDCKDIVs CKDIV=1, EN=0 0.1 1.5 RON ROFF FSKDTA=0, EN=1 FSKDTA=1, EN=1 1 20 70
0.3*Vcc
V V A A A A A A A A
VCC+0.3
M
Power Select Characteristics Power select current Power select voltage step 0 Power select voltage step 1 Power select voltage step 2 Power select voltage step 3 Power select voltage step 4 IPSEL VPS0 VPS1 VPS2 VPS3 VPS4 VLVD EN=1 EN=1 EN=1 EN=1 EN=1 EN=1 0.14 0.37 0.78 1.55 7.0 8.6 9.9 0.035 0.24 0.60 1.29 A V V V V V
Low Voltage Detection Characteristic Low voltage detect threshold EN=1 1.75 1.85 1.95 V
3901072036 Rev. 005
Page 9 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter
4.5 AC Characteristics
all parameters under normal operating conditions, unless otherwise stated; typical values at TA = 23 C and VCC = 3 V; test circuit shown in Fig. 6, fc = 868.3MHz Parameter CW Spectrum Characteristics Output power in step 0 (Isolation in off-state) Output power in step 1 Output power in step 2 Output power in step 3 Output power in step 4 Phase noise Poff P1 P2 P3 P4 L(fm) Pspur EN=1 EN=1 EN=1 EN=1 EN=1 @ 200kHz offset -13 -4 1 4 -12 -3 2.5 7.5 -87 -70 -11 1) -2 3.5 9.5
1) 1) 1)
Symbol
Condition
Min
Typ
Max
Unit
dBm dBm dBm dBm dBm dBc/Hz dBm
Spurious emissions according to EN 300 220-1 (2000.09) table 13
Clock output Characteristics Output low voltage CMOS Output high voltage CMOS Start-up Parameters Start-up time Frequency Stability Frequency stability vs. supply voltage Frequency stability vs. temperature Frequency stability vs. variation range of CRO
Y R A IN IM L E R P
-82 -54 47MHz< f <74MHz 87.5MHz< f <118MHz 174MHz< f <230MHz 470MHz< f <862MHz B=100kHz f < 1GHz, B=100kHz f > 1GHz, B=1MHz -36 -30 VOL VOH depending on capacitor CCK and CKDIV 0.7*VCC ton from standby to transmit mode 0.6 1 dfVCC dfTA dfCRO crystal at constant temperature 3 10 20
dBm dBm
0.3*VCC
V V
ms
ppm ppm ppm
1) output matching network tuned for 5V supply
3901072036 Rev. 005
Page 10 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter
4.6 AC Characteristics
Power step RPS / k
0 <3
1 22
2 56
3 120
4 not connected
4.7 Output Power Steps - ASK Mode
typical values at TA = 23 C and VCC = 3 V; test circuit shown in Fig. 6 Power step RPS / k R1 / k 1 2
VPSlow = voltage across RPS if ASK_DTA at 0V VPShigh = voltage across RPS if ASK_DTA at Vcc
Y R A IN IM L E R P
3 2.4 36 2.8 14 3.5 7
V PSlow RPS R1 V PShigh RPS
4
not connected 0
R1 Vcc
PSEL 6
PSEL 6
If the transmitter is operated at any supply voltage Vcc, the values for R1 and RPS can be calculated as follows:
R1 =
VCC VPSlow I PSEL VPShigh
RPS = R1
VPShigh VCC - VPShigh
3901072036 Rev. 005
Page 11 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 5 Test Circuit
CM2 LM CB1
10 9 8 7 6
CM1 RPS CM3 LT
OUT
VCC
VEE
OUT
FSKDTA
FSKSW
CKDIV EN
4
5.1 Test circuit component list to Fig. 6
Part
CM1 CM2 CM3 LM LT CX1_FSK CX1_ASK CX2 CCK RPS R1 CB0 CB1 XTAL
Y R A IN IM L E R P
1 2 3 5
CX2
ROI
XTAL
CCK
CX1
CB0
CKOUT
PSEL
R1
12
12
123
12
12
12
GND
GND
VCC
EN GND
FSK_DTA
VCC
VCC
GND ASK_DTA
Fig. 6: Test circuit for FSK and ASK with 50 matching network
Size
0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 SMD 6x3.5
Value @ 868.3 MHz
1.8 pF 5.6 pF 68 pF 12 nH 15 nH 22 pF 27 pF 12 pF
Value @ 915 MHz
2.2 pF 5.6 pF 68 pF 10 nH 10 nH 22 pF 27 pF 12 pF
Tolerance
5% 5% 5% 5% 5% 5% 5% 5% 5% 5% 20% 10%
CKOUT GND
CKDIV
Description
impedance matching capacitor impedance matching capacitor impedance matching capacitor impedance matching inductor, note 2 output tank inductor, note 2 XOSC FSK capacitor (f = 20 kHz), note 1 XOSC ASK capacitor, trimmed to fC, note 1 XOSC capacitor (f = 20 kHz), note 1 only needed for FSK clock spur suppression capacitor, CKDIV 0 / 1 FSK or CW mode power-select resistor ASK power-select resistor, not used at FSK
15 pF / 180 pF see section 4.6 see section 4.7 220 nF 330 pF 27.13438 MHz 28.59375 MHz
de-coupling capacitor de-coupling capacitor
30ppm calibr. fundamental wave crystal, 30ppm temp. CL = 12 pF, C0, max = 7 pF, R1 = 40
Note 1: value depending on crystal parameters Note 2: for high-power applications high-Q wire-wound inductors should be used 3901072036 Rev. 005 Page 12 of 16 Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 6 Package Description
The device TH72036 is RoHS compliant.
D 10 6 L 0.23 E E2 exposed pad 0.36 D2
0.225x45
all Dimensions in mm D E
min max 2.85 3.15 2.85 3.15
all Dimensions in inch
min 0.112 0.112 0.0878 0.051 0.0315 0 0.0118 0.0071 0.0079 0.0197 max 0.124 0.124 0.0976 0.055 0.0393 0.002 0.0197 0.0118
Y R A IN IM L E R P
e A A3 A1
1
5
b
The "exposed pad" is not connected to internal ground, it should not be connected to the PCB.
Fig. 7: 10L QFN 3x3 Dual
D2
E2
A
A1
A3
L
e
b
2.23 2.48
1.49 1.74
0.80 1.00
0 0.05
0.20
0.3 0.5
0.50
0.18 0.30
6.1 Soldering Information
* The device TH72036 is qualified for MSL3 with soldering peak temperature 260 deg C according to JEDEC J-STD-20
6.2
Recommended PCB Footprints
X Y
10 6
e C PL
all Dimensions in mm Z
min max 3.55 3.90
G
1.9 2.3
D2th
3.2 3.6
E2th
1.3 1.7
X
0.25 0.30
Y
0.7 1.0
CPL
0.3 0.5
e
0.5
ZG
1 5
E2 th
all Dimensions in inch
min 0.1398 0.0748 0.1260 0.0512 0.0098 0.0276 0.0591 0.0197 max 0.1535 0.0906 0.1417 0.0669 0.0118 0.0394 0.0197
D2 th
solder pad
solder stop
Fig. 8: PCB land pattern style
3901072036 Rev. 005
Page 13 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 7 Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture sensitivity level, as defined in this specification, according to following test methods: Reflow Soldering SMD's (Surface Mount Devices) * * IPC/JEDEC J-STD-020 "Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2)" EIA/JEDEC JESD22-A113 "Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2)"
Wave Soldering SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * *
EN60749-20 "Resistance of plastic- encapsulated SMD's to combined effect of moisture and soldering heat" EIA/JEDEC JESD22-B106 and EN60749-15 "Resistance to soldering temperature for through-hole mounted devices"
Iron Soldering THD's (Through Hole Devices) *
EN60749-15 "Resistance to soldering temperature for through-hole mounted devices"
Solderability SMD's (Surface Mount Devices) and THD's (Through Hole Devices) * EIA/JEDEC JESD22-B102 and EN60749-21 "Solderability"
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of the Use of Certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality_leadfree.aspx
Y R A IN IM L E R P
8 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901072036 Rev. 005
Page 14 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter Your Notes
Y R A IN IM L E R P
3901072036 Rev. 005
Page 15 of 16
Data Sheet June/07
TH72036
868/915MHz FSK/ASK Transmitter 9 Disclaimer
1) The information included in this documentation is subject to Melexis intellectual and other property rights. Reproduction of information is permissible only if the information will not be altered and is accompanied by all associated conditions, limitations and notices. 2) Any use of the documentation without the prior written consent of Melexis other than the one set forth in clause 1 is an unfair and deceptive business practice. Melexis is not responsible or liable for such altered documentation. 3) The information furnished by Melexis in this documentation is provided 'as is'. Except as expressly warranted in any other applicable license agreement, Melexis disclaims all warranties either express, implied, statutory or otherwise including but not limited to the merchantability, fitness for a particular purpose, title and non-infringement with regard to the content of this documentation. 4) Notwithstanding the fact that Melexis endeavors to take care of the concept and content of this documentation, it may include technical or factual inaccuracies or typographical errors. Melexis disclaims any responsibility in connection herewith. 5) Melexis reserves the right to change the documentation, the specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. 6) Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the information in this documentation. 7) The product described in this documentation is intended for use in normal commercial applications. Applications requiring operation beyond ranges specified in this documentation, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. 8) Any supply of products by Melexis will be governed by the Melexis Terms of Sale, published on www.melexis.com. (c) Melexis NV. All rights reserved.
Y R A IN IM L E R P
For the latest version of this document, go to our website at:
www.melexis.com
Or for additional information contact Melexis Direct: Europe, Africa:
Phone: +32 1367 0495 E-mail: sales_europe@melexis.com
Americas:
Phone: +1 603 223 2362 E-mail: sales_usa@melexis.com
Asia:
Phone: +32 1367 0495 E-mail: sales_asia@melexis.com
ISO/TS 16949 and ISO14001 Certified 3901072036 Rev. 005 Page 16 of 16 Data Sheet June/07


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